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Patent Searching and Data


Title:
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THEREOF
Document Type and Number:
WIPO Patent Application WO/2011/155240
Kind Code:
A1
Abstract:
Disclosed is an electronic component and a method of manufacturing thereof, wherein mounting of the electronic component onto a circuit board in an inclined state can be inhibited. The electronic component (10a) is mounted on a circuit board comprising a first land and a second land. External electrodes (14a, 14b) are formed so as to line up in the y-axis direction on the undersurface (S10) of a laminate (12), and are also connected to the first land and the second land, respectively. The contact faces of the external electrodes (14a, 14b) to the first land and the second land form a line-symmetric structure with respect to a straight line (A) parallel to the y-axis direction, and are also divided into a plurality of portions.

Inventors:
ODAHARA MITSURU (JP)
MATSUSHIMA HIDEAKI (JP)
ONO AKIHIRO (JP)
Application Number:
PCT/JP2011/056049
Publication Date:
December 15, 2011
Filing Date:
March 15, 2011
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
ODAHARA MITSURU (JP)
MATSUSHIMA HIDEAKI (JP)
ONO AKIHIRO (JP)
International Classes:
H01F27/29; H01F41/04; H01F41/10; H01G4/252
Foreign References:
JP2002280253A2002-09-27
JPS62172101U1987-10-31
JPH0529173A1993-02-05
JPH1167554A1999-03-09
Attorney, Agent or Firm:
MORISHITA Takekazu et al. (JP)
Takeichi Morishita (JP)
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Claims: