ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

WIPO Patent Application WO/2012/140936

A1

Provided is an electronic component in which a sealing member is bonded using a resin adhesive that is unlikely to spread before hardening. Also provided is a method for manufacturing the electronic component, wherein the resin adhesive is unlikely to spread before hardening. An electronic component (1) comprises: a first sealing member (10) having a main surface; a second sealing member (15) bonded to the main surface of the first sealing member (10) so as to form a sealed space (15a) together with the main surface of the first sealing member (10); a resin adhesive layer (13) disposed in a frame-shaped bonding region on the main surface of the first sealing member (10) so as to bond the first sealing member (10) and the second sealing member (15); a frame-shaped glass layer (11) provided on the main surface of the first sealing member (10) between the outer perimeter line of the frame-shaped bonding region and the peripheral edge of the main surface of the first sealing member (10); and an electronic component main body (20) disposed in the sealed space (15a). A method for manufacturing the electronic component (1).

OISHIBASHI HIDEKAZU (JP)
NAGAMINE YUICHIRO (JP)
SATO TAKEO (JP)

PCT/JP2012/052228

October 18, 2012

February 01, 2012

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MURATA MANUFACTURING CO (JP)
OISHIBASHI HIDEKAZU (JP)
NAGAMINE YUICHIRO (JP)
SATO TAKEO (JP)

H01L23/02; H01L23/10; H03H3/02; H03H9/02

JP2008112886A	2008-05-15
JPH09246867A	1997-09-19
JP2003282766A	2003-10-03

MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)

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