ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

Title:

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2018/101468

Kind Code:

A1

Abstract:

An electronic component according to the present invention is provided with: a glass base material 100 having a through-hole 101 formed so as to pass through both surfaces thereof; an insulating resin layer 120 that is stacked on each of both surfaces of the glass base material 100 and that has a copper-plated layer 103 formed in the interior thereof; and a capacitor 109 having a lower electrode 110 formed on the copper-plated layer 103, a dielectric layer 111 formed so as to be stacked on the lower electrode 110, and an upper electrode 112 formed so as to be stacked on the dielectric layer 111. A region of the upper electrode 112, said region being along the surface of the copper-plated layer 103, is formed so as to be smaller than a region of the dielectric layer 111, said region being along the surface of the copper-plated layer 103, and a region of the lower electrode 110, said region being along the surface of the copper-plated layer 103. This provides a glass core substrate having a thin-film capacitor with a highly reliable MIM structure and also achieves a compact size, a small thickness, and high reliability.

Inventors:

TAKAGI FUSAO (JP)
NAKAMURA KIYOTOMO (JP)

Application Number:

PCT/JP2017/043339

Publication Date:

June 07, 2018

Filing Date:

December 01, 2017

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TOPPAN PRINTING CO LTD (JP)

International Classes:

H05K1/16; H01G4/12; H01G4/33; H01L23/12; H05K3/46

Domestic Patent References:

WO2001082666A1

2001-11-01

Foreign References:

JP2008227177A	2008-09-25
JP2011129665A	2011-06-30
JP2010251530A	2010-11-04
JP2008084933A	2008-04-10
JP2005026670A	2005-01-27
JP2009188401A	2009-08-20
JPH10320622A	1998-12-04

Other References: