ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

Title:

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2020/039989

Kind Code:

A1

Abstract:

Provided are: an electronic component that can be easily bonded to a bonding target; and a method for manufacturing the electronic component. This electronic component comprises a ceramic element, glass-containing Au layers formed on both surfaces of the ceramic element, and an Au-Sn alloy layer formed on at least one of the glass-containing Au layers. The electronic component further comprises a pure Au layer between the glass-containing Au layer and the Au-Sn alloy layer. Furthermore, the Au—Sn alloy layer has an Au-Sn eutectic structure.

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Inventors:

ISHIKAWA MASAYUKI (JP)
DAIDO SATORU (JP)
NISHIZAWA KAORU (JP)
YOSHIDA AKIHIRO (JP)
SATO HIROKI (JP)

Application Number:

PCT/JP2019/031746

Publication Date:

February 27, 2020

Filing Date:

August 09, 2019

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP (JP)

International Classes:

H01C7/04; H01C1/01; H01C7/02; H01C17/00; H01F27/06; H01G2/06; H01G13/00; H05K3/34

Foreign References:

JP2014054653A	2014-03-27
JP2002083737A	2002-03-22
JPH10261507A	1998-09-29
JP2016136614A	2016-07-28

Attorney, Agent or Firm:

AOYAMA, Masakazu (JP)

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