Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/039989
Kind Code:
A1
Abstract:
Provided are: an electronic component that can be easily bonded to a bonding target; and a method for manufacturing the electronic component. This electronic component comprises a ceramic element, glass-containing Au layers formed on both surfaces of the ceramic element, and an Au-Sn alloy layer formed on at least one of the glass-containing Au layers. The electronic component further comprises a pure Au layer between the glass-containing Au layer and the Au-Sn alloy layer. Furthermore, the Au—Sn alloy layer has an Au-Sn eutectic structure.
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Inventors:
ISHIKAWA MASAYUKI (JP)
DAIDO SATORU (JP)
NISHIZAWA KAORU (JP)
YOSHIDA AKIHIRO (JP)
SATO HIROKI (JP)
DAIDO SATORU (JP)
NISHIZAWA KAORU (JP)
YOSHIDA AKIHIRO (JP)
SATO HIROKI (JP)
Application Number:
PCT/JP2019/031746
Publication Date:
February 27, 2020
Filing Date:
August 09, 2019
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01C7/04; H01C1/01; H01C7/02; H01C17/00; H01F27/06; H01G2/06; H01G13/00; H05K3/34
Foreign References:
JP2014054653A | 2014-03-27 | |||
JP2002083737A | 2002-03-22 | |||
JPH10261507A | 1998-09-29 | |||
JP2016136614A | 2016-07-28 |
Attorney, Agent or Firm:
AOYAMA, Masakazu (JP)
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