Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/256410
Kind Code:
A1
Abstract:
This electronic component (electrolytic capacitor 1) is provided with: an element body (resin molded body 9) having a first end surface 9a and a second end surface 9b opposing each other in a length direction L, a first main surface 9c and a second main surface 9d opposing each other in a thickness direction T orthogonal to the length direction L, and a first side surface 9e and a second side surface 9f opposing each other in a width direction W orthogonal to the length direction L and to the thickness direction T, the element body including internal electrodes (anodes 3 and cathodes 7); a first external electrode 11 provided on the first end surface 9a and connected to the internal electrodes (anodes 3) exposed on the first end surface 9a of the element body (resin molded body 9); and a second external electrode 13 provided on the second end surface 9b and connected to the internal electrodes (cathodes 7) exposed on the second end surface 9b of the element body (resin molded body 9). The first external electrode 11 includes a resin electrode layer 11a containing an electrically conductive component and a resin component. The resin electrode layer 11a of the first external electrode 11 includes a first part 11A opposing the entire surface of the first end surface 9a of the element body (resin molded body 9). A plurality of periodically arranged protrusions 15 are provided on a surface of the first part 11A of the resin electrode layer 11a of the first external electrode 11 on the side opposite to the first end surface 9a of the element body (resin molded body 9).
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Inventors:
TAMATANI YASUHIRO (JP)
KUSUDA KAZUYA (JP)
KUSUDA KAZUYA (JP)
Application Number:
PCT/JP2021/022437
Publication Date:
December 23, 2021
Filing Date:
June 14, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01C1/14; H01F27/29; H01G4/228; H01G4/30; H01G9/00; H01G9/012; H01G9/08; H01G9/15
Domestic Patent References:
| WO2018074408A1 | 2018-04-26 | |||
| WO2015037394A1 | 2015-03-19 |
Foreign References:
| JP2018182039A | 2018-11-15 | |||
| JPS6477916A | 1989-03-23 | |||
| JP2015097248A | 2015-05-21 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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