Title:
ELECTRONIC COMPONENT, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2014/174931
Kind Code:
A1
Abstract:
This camera module (10) provided with an image sensor IC (13), which has a terminal electrode (13B), and a circuit board (11) to which the image sensor IC (13) is mounted is characterized in that the circuit board (11) is provided with: a mounting electrode (18A) to which a terminal electrode (13B) is ultrasonically welded; a flat film-shaped member (18) to which the mounting electrode (18A) is provided; and a substrate member (17) to which the flat film-shaped member (18) is joined. The camera module (10) is further characterized in that the modulus of elasticity of the flat film-shaped member (18) is greater than the modulus of elasticity of the substrate member (17).
Inventors:
IKEMOTO NOBUO (JP)
OSAMURA MAKOTO (JP)
SASAKI SATOSHI (JP)
WAKABAYASHI YUKI (JP)
OSAMURA MAKOTO (JP)
SASAKI SATOSHI (JP)
WAKABAYASHI YUKI (JP)
Application Number:
PCT/JP2014/056840
Publication Date:
October 30, 2014
Filing Date:
March 14, 2014
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L21/607; H01F27/06; H01G2/06; H01L21/60; H05K1/02; H05K1/18
Foreign References:
| JP2004273777A | 2004-09-30 | |||
| JP2006120683A | 2006-05-11 | |||
| JP2002299651A | 2002-10-11 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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