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Title:
ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2017/022504
Kind Code:
A1
Abstract:
An electronic component which is provided with: an electronic element (100); a base member (300) having an upper surface (302) on which the electronic element (100) is mounted; and a lid member (200) that is bonded to the base member (300), with a bonding material (350) being interposed therebetween, so as to hermetically seal the electronic element (100). The bonding material (350) is composed of an insulating material containing a first metal. The lid member (200) has at least an outermost layer (214) that is formed on the surface facing the base member (300). The outermost layer (214) of the lid member (200) has a solid solution layer (214a) of a second metal and a metal that is the same as the first metal in at least a part of the outermost layer (214).

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Inventors:
ISHIKAWA KOUJI (JP)
KATSUBE AKIO (JP)
ISHIHARA TAKEHITO (JP)
ONO TAKESHI (JP)
Application Number:
PCT/JP2016/071415
Publication Date:
February 09, 2017
Filing Date:
July 21, 2016
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/02; H01L23/02; H03H3/02
Foreign References:
JP2000040762A2000-02-08
JP2006222522A2006-08-24
JP2000232332A2000-08-22
JP2014187341A2014-10-02
JP2014197615A2014-10-16
JP2001156197A2001-06-08
JP2004231677A2004-08-19
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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