Title:
ELECTRONIC COMPONENT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2019/111547
Kind Code:
A1
Abstract:
An electronic component which is provided with: a ceramic part that contains a low-temperature sintered ceramic material; a resin part that is superposed on the upper main surface of the ceramic part, while being composed of a resin insulating layer and a conductor pattern; and an external electrode that is provided so as to straddle the boundary between the ceramic part and the resin part. This electronic component is characterized in that a barrier layer is provided in a position below the external electrode at the boundary between the ceramic part and the resin part.
Inventors:
NAKANO SATOSHI (JP)
Application Number:
PCT/JP2018/038622
Publication Date:
June 13, 2019
Filing Date:
October 17, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F27/00; H01F17/00; H01F41/04; H01G4/228; H01G4/30
Domestic Patent References:
| WO2005071745A1 | 2005-08-04 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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