ELECTRONIC COMPONENT MODULE, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT MODULE

Title:

ELECTRONIC COMPONENT MODULE, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT MODULE

Document Type and Number:

WIPO Patent Application WO/2015/118982

Kind Code:

A1

Abstract:

Provided is an electronic component module, and a manufacturing method thereof, which is formed using a copper particle paste that enables reliable sintering all the way to the interior of the bonding material. The electronic component module has excellent oxidation resistance of the copper particles and has bonding areas with high bonding reliability. External terminals are bonded to connection targets using a copper particle paste that contains copper particles and an organic compound which has a reducing effect at the sintering temperature when the copper particles are sintered, wherein the copper particles have a particle diameter peak in the particle size distribution in the range of 0.1-5.0μm, have an average crystallite diameter before sintering in the range of 30-100nm, and, on the particle surface, do not have a dispersant that suppresses aggregation. Further, this electronic component module (30) has a structure in which the external terminals (33) of an electronic component (31) are electrically and mechanically connected to the connection targets (36) via the bonding material (34), and the bonding material is a sintered copper body which is formed by baking the aforementioned copper particle paste and has an average crystallite diameter in the range of 60-150nm.

Inventors:

KIYONO SHINYA (JP)
HAYASHI TOSHITAKA (JP)
FUJITA SHO (JP)

Application Number:

PCT/JP2015/052018

Publication Date:

August 13, 2015

Filing Date:

January 26, 2015

Export Citation:

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Assignee:

MURATA MANUFACTURING CO (JP)

International Classes:

H01L21/60; B22F1/10; H01G2/06; H05K3/32

Foreign References:

JP2004265607A	2004-09-24
JP2013091835A	2013-05-16

Other References: