Title:
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/065247
Kind Code:
A1
Abstract:
An electronic component module (101) is provided with: a plurality of components each having a terminal and disposed along a plane; a frame substrate (9) supporting at least one of the plurality of components; a sealing resin portion (4) sealing the plurality of components and the frame substrate (9); and a shield layer (5) covering an outer surface of the sealing resin portion (4). The frame substrate (9) comprises an insulating layer (9A), a ground layer (9B), and a ground bump (10) in conduction with the ground layer (9B). The frame substrate (9) includes an opening supporting a portion of a bump component (21, 22) other than a solder bump (21B, 22B). The ground layer (9B) of the frame substrate (9) is exposed on a side surface of the frame substrate (9) and is in conduction with the shield layer (5). The terminals of the plurality of components and the ground bump (10) are exposed so as to protrude from a plane (S0) of the sealing resin portion (4), and are used as mounting terminals for the electronic component module.
Inventors:
NOMURA TADASHI (JP)
KOMATSU TORU (JP)
KOMATSU TORU (JP)
Application Number:
PCT/JP2021/034370
Publication Date:
March 31, 2022
Filing Date:
September 17, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/04; H01L21/56; H01L23/00
Foreign References:
| JP2004207378A | 2004-07-22 | |||
| JP2012059832A | 2012-03-22 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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