Title:
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2020/100899
Kind Code:
A1
Abstract:
Provided are an electronic component with an improved heat-dissipating property, and an electronic component module comprising the same. The electronic component (1) is provided with a substrate (2), a function portion (3), a plurality of external-connection conductor portions (4), a first heat-conducting portion (5), and a second heat-conducting portion (6). The function portion (3) is disposed on one main surface (21) side of the substrate (2). The function portion (3) generates heat. The plurality of external-connection conductor portions (4) are disposed on one main surface (21) of the substrate (2) directly or indirectly. The first heat-conducting portion (5), when viewed in plan from a thickness direction (D1) of the substrate (2), is disposed on the other main surface (22) of the substrate (2) over, between a first region (221) not overlapping the function portion (3) and a second region (222) only overlapping the function portion (3), the first region (221) directly or indirectly. The second heat-conducting portion (6), when viewed in plan from the thickness direction (D1) of the substrate (2), is disposed on the other main surface (22) of the substrate (2) over at least a part of the second region (222) directly or indirectly, and is spaced apart from the first heat-conducting portion (5).
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Inventors:
NOMIYA MASATO
Application Number:
PCT/JP2019/044358
Publication Date:
May 22, 2020
Filing Date:
November 12, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/12; H01L23/28; H01L23/29; H03H9/145; H03H9/25; H05K1/02
Domestic Patent References:
| WO2018003819A1 | 2018-01-04 |
Foreign References:
| JPH0697331A | 1994-04-08 | |||
| JPH1174421A | 1999-03-16 | |||
| JP2014127678A | 2014-07-07 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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