Title:
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE
Document Type and Number:
WIPO Patent Application WO/2019/074130
Kind Code:
A1
Abstract:
Provided is an electronic component including: an insulating layer; a low voltage conductor pattern formed in the insulating layer; a high voltage conductor pattern formed in the insulating layer so as to face the low voltage conductor pattern in the vertical direction; and a conductive breakdown voltage holding structure formed along the high voltage conductor pattern in the insulating layer so as to protrude further to the outside than the low voltage conductor pattern in planar view.
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Inventors:
TANAKA TAKETOSHI (JP)
OSADA KOSEI (JP)
ARIMURA MASAHIKO (JP)
OSADA KOSEI (JP)
ARIMURA MASAHIKO (JP)
Application Number:
PCT/JP2018/038365
Publication Date:
April 18, 2019
Filing Date:
October 15, 2018
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01F17/00; H01F30/10; H01G4/30; H01L21/822; H01L27/04
Domestic Patent References:
| WO2016080034A1 | 2016-05-26 |
Foreign References:
| JP2016028407A | 2016-02-25 | |||
| JP2017073475A | 2017-04-13 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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