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Patent Searching and Data


Title:
ELECTRONIC COMPONENT MOUNTED SUBSTRATE, BATTERY PACK AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/156117
Kind Code:
A1
Abstract:
[Problem] An electronic component mounted substrate according to the present invention is provided with: a substrate which comprises a first substrate terminal, a second substrate terminal and an insulating material that is arranged between the first substrate terminal and the second substrate terminal; and an electronic component which is arranged on the insulating material, while having a first terminal that is connected to the first substrate terminal and a second terminal that is connected to the second substrate terminal. The insulating material is projected beyond the surface of the substrate and protrudes toward a portion of the periphery of the electronic component, said portion being positioned between the first terminal and the second terminal. The length x of the protrusion of the insulating material toward the portion of the periphery, and the length a of the electronic component in the direction from the first terminal toward the second terminal satisfy the relational expression x ≥ a/4.

Inventors:
MORI YASUSHI (JP)
Application Number:
JP2019/004236
Publication Date:
August 15, 2019
Filing Date:
February 06, 2019
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/18; H01M2/10; H01M10/0562; H05K1/02
Foreign References:
JPS52158852U1977-12-02
JP2015220102A2015-12-07
JP2003298220A2003-10-17
Attorney, Agent or Firm:
SUGIURA, Masatomo et al. (JP)
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