Title:
ELECTRONIC COMPONENT MOUNTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/090957
Kind Code:
A1
Abstract:
The present invention comprises: a wafer ring (42); a collet (30); a pickup head (20) that drives the collet (30) in a horizontal direction; a wafer-side illumination unit (29); a wafer-side camera (12); an image processing unit; and a control unit, wherein the wafer-side camera (12) captures an image of reflected light reflected on the surface of a wafer (35) directly below the collet (30), the image processing unit detects a collet center position on the basis of each image and detects a deviation between the collet center position and a reference position of the wafer-side camera (12) in a visual field, and the control unit adjusts the horizontal position of the collet (30) by means of the pickup head (20) on the basis of the deviation. Accordingly, a decrease in the mounting accuracy of a semiconductor die on a substrate is suppressed.
Inventors:
MAEDA TORU (JP)
OMATA HIROSHI (JP)
OMATA HIROSHI (JP)
Application Number:
PCT/JP2019/042724
Publication Date:
May 07, 2020
Filing Date:
October 31, 2019
Export Citation:
Assignee:
YAMAHA MOTOR ROBOTICS HOLDINGS CO LTD (JP)
International Classes:
H01L21/52; H01L21/60
Foreign References:
| JP2015060926A | 2015-03-30 | |||
| JP2014179561A | 2014-09-25 | |||
| JP2003218132A | 2003-07-31 | |||
| JP2017139411A | 2017-08-10 | |||
| JPH10145094A | 1998-05-29 |
Attorney, Agent or Firm:
YKI INTELLECTUAL PROPERTY ATTORNEYS (JP)
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