Title:
ELECTRONIC COMPONENT MOUNTING BOARD, ELECTRIC DEVICE, AND LIGHT EMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/070946
Kind Code:
A1
Abstract:
An electronic component mounting board (A) according to a mode of an embodiment has a plate-like base (1), the base (1) having a first surface (1a) which is inclined with respect to a second surface (1b) facing the first surface (1a), wherein, when the base (1) is equally divided in the inclining direction into two parts of which one is a lower portion (1L) and the other is a higher portion (1H), the thermal conductivity of the lower portion (1L) is higher than the thermal conductivity of the higher portion (1H). An electric device of the embodiment has the electronic component mounting board (A) described above and an electronic component mounted on the first surface (1a). A light emitting device of the embodiment has the electronic component mounting board (A) described above and a light emitting element (4) mounted on the first surface (1a), wherein the electronic component mounting board (A) has a bank portion (5) disposed on the first surface (1a) so as to surround the light emitting element (4), the bank portion (5) having an opening portion (5a) penetrating therethrough in the planar direction of the first surface (1a) .
Inventors:
YAMAGUCHI TAKAFUMI (JP)
HIGASHI TOSHIFUMI (JP)
FURUKUBO YOUJI (JP)
HIGASHI TOSHIFUMI (JP)
FURUKUBO YOUJI (JP)
Application Number:
PCT/JP2019/028170
Publication Date:
April 09, 2020
Filing Date:
July 17, 2019
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/12; H01S5/022
Domestic Patent References:
| WO2017094589A1 | 2017-06-08 | |||
| WO2018142499A1 | 2018-08-09 |
Foreign References:
| JP2006196505A | 2006-07-27 | |||
| JP2003124408A | 2003-04-25 | |||
| JP2011040534A | 2011-02-24 | |||
| JP2015231009A | 2015-12-21 |
Other References:
See also references of EP 3863046A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Download PDF: