Title:
ELECTRONIC COMPONENT MOUNTING DEVICE AND DISPENSER
Document Type and Number:
WIPO Patent Application WO/2017/179459
Kind Code:
A1
Abstract:
An electronic component mounting device of the present disclosure comprises: an installation head which takes out an electronic component from a part feeder, and transfers and installs the electronic component on a substrate; a dispenser applying a paste onto a lower surface of the electronic component taken out by the installation head, the paste being caused to fly out of an upwardly opening ejection hole against gravity; and a shield member which is disposed between the electronic component and the dispenser, and which has an opening above the ejection hole.
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Inventors:
IKEDA KOUJI
Application Number:
PCT/JP2017/014053
Publication Date:
October 19, 2017
Filing Date:
April 04, 2017
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K13/04; B05C5/00; H05K3/34
Foreign References:
| JP2012028780A | 2012-02-09 | |||
| JPH06198231A | 1994-07-19 | |||
| JP2014506536A | 2014-03-17 | |||
| JP2009175708A | 2009-08-06 | |||
| JP2015015377A | 2015-01-22 | |||
| JP2016082085A | 2016-05-16 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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