ELECTRONIC-COMPONENT-MOUNTING DEVICE

WIPO Patent Application WO/2016/024365

A1

This mounting device is provided with the following: a mounting tool (14); a support mechanism comprising a vertically-movable moving body (24) and the like to which the mounting tool is attached; a first pressure-applying mechanism that is driven by a z-axis motor (18) and applies a first load to an electronic component by moving the entire support mechanism, including the mounting tool, vertically; a second pressure-applying mechanism that is provided between the support mechanism and the mounting tool, is driven by a VCM (30), and applies a second load to the electronic component by moving the mounting tool vertically relative to the support mechanism; a load cell (38) that is directly or indirectly connected to the mounting tool; and a control unit that controls the driving of the first and second pressure-applying mechanisms. When using the first pressure-applying mechanism to apply the abovementioned first load, the control unit first drives the second pressure-applying mechanism so as to make the load cell contact the support mechanism, applying a pre-load. An electronic-component-mounting device that, with a simpler structure, can precisely apply both light loads and heavy loads to electronic components is thus provided.

SATO AKIRA (JP)
SEYAMA KOHEI (JP)

PCT/JP2014/077402

February 18, 2016

October 15, 2014

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SHINKAWA KK (JP)

H05K13/04; H01L21/52; H01L21/603

WO2014076809A1

2014-05-22

JP2008251727A	2008-10-16
JP2002043797A	2002-02-08
JP2002299894A	2002-10-11
JP2006147702A	2006-06-08
JP3449139B2	2003-09-22
JP2004158743A	2004-06-03

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