Title:
ELECTRONIC COMPONENT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/092306
Kind Code:
A1
Abstract:
A flip-chip bonding device (100) is provided with: a bonding tool (10) that includes a base (11), and an island (13) that vacuum-sucks, to a surface (14) thereof, a semiconductor die (70) having protruding electrodes (72, 73) that are disposed on both the surfaces; and a heater (20) that heats the semiconductor die (70) vacuum-sucked to the island (13). The flip-chip bonding device heats the semiconductor die (70), bonds the protruding electrode (73) of the semiconductor die (70) to a protruding electrode (82) of a semiconductor die (80), and seals, using a non-conductive film (NCF) (75), a gap between the semiconductor die (70) and the semiconductor die (80). A plurality of continuously vacuum-sucking holes (15) are provided in the base (11), said continuously vacuum-sucking holes being at positions adjacent to the outer peripheral surface of the island (13). Consequently, in this electronic component mounting device that seals between the semiconductor dice using the resin, contamination of the bonding tool is suppressed.
Inventors:
NAGAI SATORU (JP)
TAKAYAMA SHIN (JP)
KOBAYASHI MIDORI (JP)
TAKAYAMA SHIN (JP)
KOBAYASHI MIDORI (JP)
Application Number:
PCT/JP2016/084442
Publication Date:
May 24, 2018
Filing Date:
November 21, 2016
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/60; H01L25/065; H01L25/07; H01L25/18; H05K13/04
Foreign References:
| JP2016192501A | 2016-11-10 | |||
| JPH07161742A | 1995-06-23 | |||
| JPH06338543A | 1994-12-06 |
Attorney, Agent or Firm:
YKI PATENT ATTORNEYS (JP)
Download PDF: