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Title:
ELECTRONIC COMPONENT, COMPONENT MOUNTING EQUIPMENT, AND COMPONENT MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO2002035903
Kind Code:
A3
Abstract:
The component mounting equipment (30) mounts an FPC board (12) on an LCD board (11). The LCD board (11) has a first electrode section (11b) on one side edge and a second electrode section (11c) on another side edge. The FPC board (12) has a first section (12a) on one side edge and a second section (12b) on other side edge. A first mounting apparatus (31) mounts the first section (12a) on the first electrode section (11b). A second mounting apparatus (32) mounts the second section (12b) on the second electrode section (11c). In the second component mounting apparatus (32), the second section (12b) is separated from the second electrode section (11b) at an ACF supply section (170) and released at a pre-press bonding section (180).

Inventors:
NISHINO KENICHI (JP)
KANAYAMA SHINJI (JP)
TSUJI SHINJIRO (JP)
IDA MASAYUKI (JP)
NISHIMOTO TOMOTAKA (JP)
Application Number:
PCT/JP2001/009265
Publication Date:
September 18, 2003
Filing Date:
October 23, 2001
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
NISHINO KENICHI (JP)
KANAYAMA SHINJI (JP)
TSUJI SHINJIRO (JP)
IDA MASAYUKI (JP)
NISHIMOTO TOMOTAKA (JP)
International Classes:
G02F1/13; G09F9/00; H01L21/60; G02F1/1345; H05K1/02; H05K1/11; H05K1/14; H05K13/04; H01R4/04; H05K1/18; H05K3/36; (IPC1-7): H05K1/11; H05K13/04; G02F1/13
Foreign References:
US5737053A1998-04-07
US5639009A1997-06-17
US5575059A1996-11-19
US5111363A1992-05-05
Other References:
PATENT ABSTRACTS OF JAPAN vol. 018, no. 267 (P - 1741) 20 May 1994 (1994-05-20)
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 09 30 September 1997 (1997-09-30)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 09 13 October 2000 (2000-10-13)
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 08 29 August 1997 (1997-08-29)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 25 12 April 2001 (2001-04-12)
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