ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTING METHOD

WIPO Patent Application WO/2013/084398

A1

An electronic component mounting line that sequentially performs solder-paste printing on to a circuit board, electronic component mounting, and reflow, while transferring the circuit board from upstream to downstream, and comprises: a circuit board supply device that supplies the circuit board; a screen printing device that applies the solder paste to the supplied circuit board; a first electronic component mounting device that mounts a first electronic component to the circuit board; a resin application device that applies a heat-curable resin to at least one reinforcing position set on the circuit board; a second electronic component mounting device that mounts a second electronic component to the circuit board, such that the rim section thereof and the heat-curable resin come in contact; and a reflow device that bonds the first electronic component and the second electronic component to the circuit board, by heating the circuit board having the first electronic component and the second electronic component mounted thereto, and then allowing same to cool. The second electronic component mounting device is arranged adjacent to the resin application device, on the downstream side thereof.

MAEDA TADASHI
MARUO HIROKI
SAEKI TSUBASA

PCT/JP2012/006719

June 13, 2013

October 19, 2012

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PANASONIC CORP (JP)

H05K13/00; H05K13/04

JP2007018505A	2007-01-25
JP2010251579A	2010-11-04
JP2005026648A	2005-01-27
JP2003273165A	2003-09-26
JP2007266330A	2007-10-11

KAWASAKI, Shinichi et al. (JP)
Shin-ichi Kawasaki (JP)

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