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Patent Searching and Data


Title:
ELECTRONIC COMPONENT MOUNTING MACHINE AND MEASUREMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2014/155657
Kind Code:
A1
Abstract:
In an electronic component mounting machine provided with a plurality of measurement devices (100) which measure electrical characteristics of an electronic component by electrically connecting a plurality of device-side electrodes (102) to a plurality of component-side electrodes of the electronic component, and a mounting platform (110) on which an arbitrary measurement device among the plurality of measurement devices is mounted, arrangements of the plurality of device-side electrodes for each measurement device are different, and it is possible to mount another measurement device to the mounting portion instead of the measurement device mounted on the mounting platform. As a result, it becomes possible to measure electrical characteristics of various electronic components by exchanging the measurement device.

Inventors:
OKADA TAKEHITO (JP)
HOSOI NORIO (JP)
Application Number:
PCT/JP2013/059480
Publication Date:
October 02, 2014
Filing Date:
March 29, 2013
Export Citation:
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Assignee:
FUJI MACHINE MFG (JP)
International Classes:
H05K13/08; G01R31/00
Foreign References:
JP2011159964A2011-08-18
JP2005303143A2005-10-27
JP2011159964A2011-08-18
Other References:
See also references of EP 2981164A4
Attorney, Agent or Firm:
NEXT INTERNATIONAL (JP)
Patent business corporation NeXT (JP)
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