Title:
ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2020/235545
Kind Code:
A1
Abstract:
An electronic component mounting method for mounting an electronic component over a land, formed on a substrate, via solder comprises: a detecting step for detecting a forming position of a land (51a, 51b) formed on a substrate (30); a solder printing step for printing solder (52a, 52b) in the detected forming position P2 from above; a mounting step for mounting, on the substrate (30) with the solder (52a, 52b) printed thereon, an LED (54) in a design position P1, which is a land position according to design, from above; and a reflow step for heating the substrate (30) with the LED (54) mounted thereon to perform bonding by means of solder.
Inventors:
INOUE MASAFUMI (JP)
EZAKI RYOTA (JP)
KUNUGI ISAO (JP)
AITANI MAKOTO (JP)
EZAKI RYOTA (JP)
KUNUGI ISAO (JP)
AITANI MAKOTO (JP)
Application Number:
PCT/JP2020/019736
Publication Date:
November 26, 2020
Filing Date:
May 19, 2020
Export Citation:
Assignee:
SIIX CORP (JP)
International Classes:
B23K1/00; H05K3/34; H05K13/04
Foreign References:
| JP2003163449A | 2003-06-06 | |||
| JP2004048044A | 2004-02-12 | |||
| JP2004039873A | 2004-02-05 | |||
| JP2018152502A | 2018-09-27 | |||
| JP2008199070A | 2008-08-28 | |||
| JP2013088699A | 2013-05-13 |
Attorney, Agent or Firm:
YAMAMOTO Hideaki et al. (JP)
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