Title:
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MOUNTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/089948
Kind Code:
A1
Abstract:
Provided is an electronic component and an electronic component mounting structure that can suppress cracking. This electronic component comprises a component body 10 having a length direction L, and a first external electrode 21 and a second external electrode 22 that are a pair of external electrodes 20 disposed on respective ends in the length direction L of the component body 10. The component body 10 includes, in at least a part thereof that is exposed between the pair of external electrodes 20, a central periphery portion 30 that is a protruding portion protruding outside the pair of external electrodes 20 in one direction orthogonal to the length direction L.
Inventors:
TAKEDA MOTONORI (JP)
ABE YOSHIYUKI (JP)
ABE YOSHIYUKI (JP)
Application Number:
PCT/JP2023/025663
Publication Date:
May 02, 2024
Filing Date:
July 12, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/30; H01G2/06; H01G4/224; H05K1/03
Foreign References:
| JP2010153445A | 2010-07-08 | |||
| JPH0533568U | 1993-04-30 | |||
| JPS5966189A | 1984-04-14 | |||
| JPH1097942A | 1998-04-14 | |||
| JPH0917607A | 1997-01-17 | |||
| JPS49129048U | 1974-11-06 | |||
| JP2014239196A | 2014-12-18 | |||
| JP2014096474A | 2014-05-22 |
Attorney, Agent or Firm:
KATO Ryuta et al. (JP)
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