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Patent Searching and Data


Title:
ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC COMPONENT ACCOMMODATING PACKAGE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/042627
Kind Code:
A1
Abstract:
[Problem] When an external stress is applied to a grounding conductor forming a coplanar line together with a wire conductor, the ground conductor might peel off from a substrate, causing an impedance mismatch in the coplanar line comprising the grounding conductor and the wire conductor . [Solution] An electronic component mounting substrate (1) based on an embodiment of the present invention is provided with grounding conductors (13) having one end joined to a substrate (5) via a brazing filler metal (11) such that the grounding conductors (13) sandwich a wire conductor (9) therebetween. The substrate (5) has a recessed portion (19) in between the joint portion of the grounding conductor (13) and the outside of the joint portion of the wire conductor (9), and the brazing filler metal (11) is joined to the inner surface of the recessed portion (19). It is possible to reduce the chance that the grounding conductor (13) is peeled off from the substrate (5).

Inventors:
TSUJINO MAHIRO (JP)
Application Number:
JP2012/073624
Publication Date:
March 28, 2013
Filing Date:
September 14, 2012
Export Citation:
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Assignee:
KYOCERA CORP (?6128501, JP)
TSUJINO MAHIRO (JP)
International Classes:
H01L23/04; H01L23/02; H01L23/12
Foreign References:
JP2003152124A2003-05-23
JP2011044670A2011-03-03
JP2002208765A2002-07-26
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Claims: