Title:
ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2007/080793
Kind Code:
A1
Abstract:
In an electronic component mounting system configured by connecting a plurality
of mounting apparatuses, a substrate ID code given to a substrate by digital data
is read by a substrate supplying apparatus in the uppermost stream, and is transmitted
to a mounting apparatus in downstream through a communicating means. In the mounting
apparatus, the transmitted substrate ID code is compared with the code data (failure
substrate code, read error code, dummy substrate code or the like), which is of
the substrates not required to be mounted and is previously stored in a storage
section, and whether to mount the substrate or not is judged. The substrate judged
not to be necessarily mounted is carried out to the downstream without being mounted,
without stopping the line.
Inventors:
SUMI HIDEKI
Application Number:
PCT/JP2006/326083
Publication Date:
July 19, 2007
Filing Date:
December 27, 2006
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
SUMI HIDEKI
SUMI HIDEKI
International Classes:
H05K13/04; H05K13/08
Foreign References:
| JP2003110297A | 2003-04-11 | |||
| JPH02185352A | 1990-07-19 | |||
| JP2004327696A | 2004-11-18 | |||
| JPH01160095A | 1989-06-22 | |||
| JP2004167622A | 2004-06-17 |
Attorney, Agent or Firm:
TANAKA, Mitsuo et al. (IMP Building 3-7, Shiromi 1-chome, Chuo-k, Osaka-shi Osaka 01, JP)
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