Title:
ELECTRONIC-COMPONENT-MOUNTING SYSTEM AND ELECTRONIC-COMPONENT MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/076967
Kind Code:
A1
Abstract:
The present invention sets one of the following modes, in advance, in mounting information (40 (2)), on the basis of the amount of positional shift between the position of a printed solder and the position of an electrode, as a mounting mode to be executed for each electronic component: a first mounting mode for transporting an electronic component to a corrected mounting position and mounting the same thereon; and a second mounting mode for transporting an electronic component to a mounting position with only the electrode position as a reference therefor, and mounting the same thereon. When performing the component-mounting operation, the electronic component is mounted on a substrate according to the mounting mode set in the mounting information (40 (2)).
Inventors:
ITOH KATSUHIKO
NAKAMURA MITSUO
NAGAI DAISUKE
OKAMOTO KENJI
NAKAMURA MITSUO
NAGAI DAISUKE
OKAMOTO KENJI
Application Number:
PCT/JP2013/006726
Publication Date:
May 22, 2014
Filing Date:
November 15, 2013
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
H05K13/04
Foreign References:
| JP4367524B2 | 2009-11-18 | |||
| JP2008270696A | 2008-11-06 | |||
| JP3983274B2 | 2007-09-26 | |||
| JP2008072035A | 2008-03-27 |
Attorney, Agent or Firm:
HASHIMOTO, Kimihide et al. (JP)
Kimihide Hashimoto (JP)
Kimihide Hashimoto (JP)
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