ELECTRONIC COMPONENT PACKAGE, CIRCUIT MODULE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT PACKAGE

Title:

ELECTRONIC COMPONENT PACKAGE, CIRCUIT MODULE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT PACKAGE

Document Type and Number:

WIPO Patent Application WO/2018/084143

Kind Code:

A1

Abstract:

This electronic component package comprises: an electronic component (20) that has a plurality of external terminals (21); a plurality of conduction members (30) that are connected to the plurality of external terminals (21); and a resin sealing member (40) that covers the electronic component (20) and a part of each one of the plurality of conduction members (30). The resin sealing member (40) has a mounting surface (40b) that is on the mounting side thereof; and the plurality of conduction members (30) have exposure parts (31) that are exposed from the mounting surface (40b).

Inventors:

MATSUKAWA YOSHITAKA (JP)
ESHITA YUYA (JP)

Application Number:

PCT/JP2017/039330

Publication Date:

May 11, 2018

Filing Date:

October 31, 2017

Export Citation:

Click for automatic bibliography generation Help

Assignee:

MURATA MANUFACTURING CO (JP)

International Classes:

H01L23/12; H01L23/00; H01L25/04; H01L25/18; H05K3/28

Domestic Patent References:

WO2012137714A1

2012-10-11

Foreign References:

JP2011142159A	2011-07-21
JP2012028700A	2012-02-09
JP2016149386A	2016-08-18

Attorney, Agent or Firm:

YOSHIKAWA, Shuichi et al. (JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: QUINOLINE COMPOUND HAVING OXIME GROUP, N-OXIDE OR SALT THEREOF, AGRICULTURAL AND HORTICULTURAL INSEC...

Next Patent: MOTOR