ELECTRONIC COMPONENT PACKAGE, COVER BODY FOR SUCH ELECTRONIC COMPONENT PACKAGE, COVER MATERIAL FOR SUCH COVER BODY AND METHOD FOR MANUFACTURING SUCH COVER MATERIAL

WIPO Patent Application WO/2006/098233

A1

A cover body for an electronic component package is provided with a base material layer (2) formed of a low thermal expansion metal; an intermediate metal layer (3), which is stacked on one surface of the base material layer (2) and is formed of a Cu-Ni alloy containing a Ni of 0.5-6.0 mass% or a Cu-Ag alloy containing a Ag of 0.05-10 mass%; and a solder material layer (4) stacked on the intermediate metal layer (3) and is formed of an alloy having silver as a main ingredient. By using such cover body, warp is not easily generated even when degassing process or the like is performed for heating and removing water prior to soldering the cover body to a case, and the case is not easily broken while soldering is performed.

Shiomi, Kazuhiro c/o NEOMAX MATERIALS CO. (LTD. 2-19-1 Minami-Suita, Suita-sh, Osaka 43, 56400, JP)
Ishio, Masaaki c/o NEOMAX MATERIALS CO. (LTD. 2-19-1 Minami-Suita, Suita-sh, Osaka 43, 56400, JP)

PCT/JP2006/304720

September 21, 2006

March 10, 2006

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NEOMAX MATERIALS CO., LTD. (2-19-1, Minami-Suita Suita-sh, Osaka 43, 56400, JP)
Shiomi, Kazuhiro c/o NEOMAX MATERIALS CO. (LTD. 2-19-1 Minami-Suita, Suita-sh, Osaka 43, 56400, JP)
Ishio, Masaaki c/o NEOMAX MATERIALS CO. (LTD. 2-19-1 Minami-Suita, Suita-sh, Osaka 43, 56400, JP)

H01L23/02

Honda, Tatsuo (HONDA PATENT OFFICE, Pressance Shin-Osaka Station Front 1-18-26-902, Higashinakajima, Higashiyodogawa-k, Osaka-shi Osaka 33, 53300, JP)

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