Title:
ELECTRONIC COMPONENT PACKAGE SEALING MEMBER, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR FABRICATING ELECTRONIC COMPONENT PACKAGE SEALING MEMBER
Document Type and Number:
WIPO Patent Application WO/2011/108715
Kind Code:
A1
Abstract:
Disclosed is an electronic component package, wherein a stable conduction state is ensured at a penetration hole provided in a sealing member, and the inside of the electronic component package can be sufficiently sealed. An electronic component package comprises: a first sealing member (electronic component package sealing member) (4) and a second sealing member (6) which are disposed facing each other and hermetically seal electrodes (31, 32) of an electronic component element (2); an inner electrode (55) which is formed on a surface (42) that is on a base of the first sealing member (4) and faces the second sealing member (6), and an outer electrode (56) which is formed on a surface (43) that is on the base of the first sealing member (4) and faces the surface (42); a penetration hole (49) which penetrates the base of the first sealing member (4); and a penetration electrode (57) which is formed inside the penetration hole (49) through which the inner electrode (55) and the outer electrode (56) are electrically connected. At least one open surface of the penetration hole (49) is sealed by a resin material (58).
Inventors:
KOHDA NAOKI (JP)
Application Number:
PCT/JP2011/055106
Publication Date:
September 09, 2011
Filing Date:
March 04, 2011
Export Citation:
Assignee:
DAISHINKU CORP (JP)
KOHDA NAOKI (JP)
KOHDA NAOKI (JP)
International Classes:
H03H9/02; H01L23/02; H03H3/02
Domestic Patent References:
| WO2007040051A1 | 2007-04-12 |
Foreign References:
| JP2004214787A | 2004-07-29 | |||
| JP2005191740A | 2005-07-14 | |||
| JP2008047652A | 2008-02-28 | |||
| JP2002353632A | 2002-12-06 | |||
| JP2006196619A | 2006-07-27 |
Attorney, Agent or Firm:
ARC PATENT ATTORNEYS' OFFICE (JP)
Patent business corporation ARC PATENT ATTORNEYS' OFFICE (JP)
Patent business corporation ARC PATENT ATTORNEYS' OFFICE (JP)
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Claims: