Title:
ELECTRONIC COMPONENT PACKAGE
Document Type and Number:
WIPO Patent Application WO/2008/059693
Kind Code:
A1
Abstract:
In an electronic component package, an electronic component element is mounted
on a metal base, the electronic component element is covered by covering the metal
base with a metal cap, and the electronic component element is hermetically sealed
by bonding the metal base with the metal cap by resistance welding. In the electronic
component package, a protruding section is arranged at a part to which the metal
cap of the metal base abuts, and the protruding leading end of the protruding section
is composed of a flat surface. Alternatively, the protruding section has a cross-section
having a shape formed by combining an arc part on an upper side of an isosceles trapezoid.
Inventors:
KUMATANI KAZUHIKO (JP)
TAKANO YOSHIHISA (JP)
NAKAMURA NAOTOSHI (JP)
OGASA MOTOTSUGU (JP)
NAKAMURA TAKASHI (JP)
IIZUKA MINORU (JP)
TAKANO YOSHIHISA (JP)
NAKAMURA NAOTOSHI (JP)
OGASA MOTOTSUGU (JP)
NAKAMURA TAKASHI (JP)
IIZUKA MINORU (JP)
Application Number:
PCT/JP2007/070407
Publication Date:
May 22, 2008
Filing Date:
October 19, 2007
Export Citation:
Assignee:
DAISHINKU CORP (JP)
KUMATANI KAZUHIKO (JP)
TAKANO YOSHIHISA (JP)
NAKAMURA NAOTOSHI (JP)
OGASA MOTOTSUGU (JP)
NAKAMURA TAKASHI (JP)
IIZUKA MINORU (JP)
KUMATANI KAZUHIKO (JP)
TAKANO YOSHIHISA (JP)
NAKAMURA NAOTOSHI (JP)
OGASA MOTOTSUGU (JP)
NAKAMURA TAKASHI (JP)
IIZUKA MINORU (JP)
International Classes:
H01L23/02; H03H9/02
Foreign References:
| JP2002011579A | 2002-01-15 | |||
| JPH0537280A | 1993-02-12 | |||
| JPH044982A | 1992-01-09 |
Attorney, Agent or Firm:
KURAUCHI, Giro (14-3 Nishitemma 4-chome,Kita-ku, Osaka-shi, Osaka 47, JP)
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