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Patent Searching and Data


Title:
ELECTRONIC COMPONENT PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/026229
Kind Code:
A1
Abstract:
An embodiment discloses an electronic component package comprising: a housing including a flow path arranged on one surface thereof; and an inlet and an outlet arranged on the housing, wherein the flow path includes a first area connected with the inlet and a second area connected with the outlet, the first area includes a guide, and the guide includes an area of which the width gradually widens from the inlet.

Inventors:
BAIK JI HYEON (KR)
Application Number:
PCT/KR2017/008427
Publication Date:
February 08, 2018
Filing Date:
August 04, 2017
Export Citation:
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Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K7/20; H02M7/00
Foreign References:
JP2002046482A2002-02-12
JPH09280278A1997-10-28
KR101328322B12013-11-11
KR20140001144A2014-01-06
JPH08204079A1996-08-09
Other References:
See also references of EP 3496521A4
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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