Title:
ELECTRONIC COMPONENT PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/026229
Kind Code:
A1
Abstract:
An embodiment discloses an electronic component package comprising: a housing including a flow path arranged on one surface thereof; and an inlet and an outlet arranged on the housing, wherein the flow path includes a first area connected with the inlet and a second area connected with the outlet, the first area includes a guide, and the guide includes an area of which the width gradually widens from the inlet.
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Inventors:
BAIK JI HYEON (KR)
Application Number:
PCT/KR2017/008427
Publication Date:
February 08, 2018
Filing Date:
August 04, 2017
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K7/20; H02M7/00
Foreign References:
JP2002046482A | 2002-02-12 | |||
JPH09280278A | 1997-10-28 | |||
KR101328322B1 | 2013-11-11 | |||
KR20140001144A | 2014-01-06 | |||
JPH08204079A | 1996-08-09 |
Other References:
See also references of EP 3496521A4
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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