Title:
ELECTRONIC COMPONENT, AND PROCESS FOR PRODUCING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2006/129542
Kind Code:
A1
Abstract:
This invention provides an electronic component, which can prevent a plating liquid from entering the inside of a ceramic element through an external electrode and can prevent moisture in the external environment from entering the inside of the ceramic element and, at the same time, is free from poor soldering adhesion and solder popping defect caused by the precipitation of glass components on the surface of an external electrode and is highly reliable, and a process for producing the same. The electronic component comprises Cu baked electrode layers (6a, 6b) composed mainly of Cu, Cu plating layers (7a, 7b) formed on the Cu baked electrode layers (6a, 6b) and subjected to recrystallization, and upper layer-side plating layers (9a, 9b) formed on the Cu plating layers (7a, 7b). After the formation of the Cu plating layers (7a, 7b), heat treatment is carried out at a temperature at or above the recrystallization temperature of the Cu plating layers (7a, 7b), and below the softening temperature of glass contained in an electrically conductive paste to recrystallize the Cu plating layers (7a, 7b).
Inventors:
KATSUBE HIROSHI (JP)
NISHIKAWA JUN (JP)
NISHIKAWA JUN (JP)
Application Number:
PCT/JP2006/310389
Publication Date:
December 07, 2006
Filing Date:
May 24, 2006
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
KATSUBE HIROSHI (JP)
NISHIKAWA JUN (JP)
KATSUBE HIROSHI (JP)
NISHIKAWA JUN (JP)
International Classes:
H01G4/12; H01G4/30
Foreign References:
| JPH08264371A | 1996-10-11 | |||
| JP2004055679A | 2004-02-19 | |||
| JP2004172383A | 2004-06-17 | |||
| JP2005064494A | 2005-03-10 | |||
| JP2001230151A | 2001-08-24 |
Attorney, Agent or Firm:
Nishizawa, Hitoshi (Daido Seimei Minami-kan 1-2-11 Edobori, Nishi-k, Osaka-shi Osaka 02, JP)
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