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Patent Searching and Data


Title:
ELECTRONIC COMPONENT AND PROCESS FOR PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2010/128609
Kind Code:
A1
Abstract:
Disclosed are: an electronic component in which the decrease in insulation between a coil and an external electrode can be prevented; and a process for producing the electronic component. A laminate (12) comprises a porous material. A coil (L1) is embedded in the laminate (12). A coil (L2) is embedded in the laminate (12), and is not electrically connected to the coil (L1). The coil (L1) and the coil (L2) together form a common mode choke coil. The coil (L1) is connected to external electrodes (14a, 14b), and the electrodes (14a, 14b) are arranged on the surface of the laminate (12). In the laminate (12), a crystallized glass is filled in voids present in an area (R2) in contact with the external electrodes (14a, 14b).

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Inventors:
IWASAKI Keisuke (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
岩崎 恵介 (〒55 京都府長岡京市東神足1丁目10番1号 株式会社村田製作所内 Kyoto, 〒6178555, JP)
Application Number:
JP2010/055052
Publication Date:
November 11, 2010
Filing Date:
March 24, 2010
Export Citation:
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Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足1丁目10番1号 Kyoto, 〒6178555, JP)
IWASAKI Keisuke (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
H01F27/29; H01F17/00; H01F41/04; H01G4/12; H01G4/30
Attorney, Agent or Firm:
MORISHITA Takekazu et al. (Hommachi Eiwa Building, 2-10 Minamihommachi 4-chome, Chuo-ku, Osaka-sh, Osaka 54, 〒5410054, JP)
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