Title:
ELECTRONIC COMPONENT AND PROCESS FOR PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2010/128609
Kind Code:
A1
Abstract:
Disclosed are: an electronic component in which the decrease in insulation between a coil and an external electrode can be prevented; and a process for producing the electronic component.
A laminate (12) comprises a porous material. A coil (L1) is embedded in the laminate (12). A coil (L2) is embedded in the laminate (12), and is not electrically connected to the coil (L1). The coil (L1) and the coil (L2) together form a common mode choke coil. The coil (L1) is connected to external electrodes (14a, 14b), and the electrodes (14a, 14b) are arranged on the surface of the laminate (12). In the laminate (12), a crystallized glass is filled in voids present in an area (R2) in contact with the external electrodes (14a, 14b).
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Inventors:
IWASAKI KEISUKE (JP)
OIWA NAOTAKA (JP)
OIWA NAOTAKA (JP)
Application Number:
PCT/JP2010/055052
Publication Date:
November 11, 2010
Filing Date:
March 24, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
IWASAKI KEISUKE (JP)
OIWA NAOTAKA (JP)
IWASAKI KEISUKE (JP)
OIWA NAOTAKA (JP)
International Classes:
H01F27/29; H01F17/00; H01F41/04; H01G4/12; H01G4/30
Foreign References:
| JP2004297020A | 2004-10-21 | |||
| JP2958523B1 | 1999-10-06 | |||
| JPH1154369A | 1999-02-26 | |||
| JPH11340006A | 1999-12-10 | |||
| JPH09129479A | 1997-05-16 | |||
| JP2005038904A | 2005-02-10 |
Attorney, Agent or Firm:
MORISHITA Takekazu et al. (JP)
Takeichi Morishita (JP)
Takeichi Morishita (JP)
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