Title:
ELECTRONIC COMPONENT AND PRODUCTION METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2023/188683
Kind Code:
A1
Abstract:
The present invention provides an electronic component that is capable of reducing stress applied to an element due to flexibility in a substrate, while suppressing an increase in direct current resistance. The electronic component comprises an element and an external electrode provided to the element, wherein: the element is provided with a first end surface, a second end surface that is opposite from the first end surface, and a bottom surface that is perpendicular to the first end surface and the second end surface; the external electrode is provided with a first external electrode that is provided to the first end surface side and a second external electrode that is provided to the second end surface side; the first external electrode is provided with a metal electrode that is provided to at least a part of the bottom surface and a resin electrode that covers a part of the portion of the metal electrode which is provided to the bottom surface; and on the bottom surface, the metal electrode has an exposed portion that is exposed from the resin electrode.
Inventors:
OTSUKA DAISUKE (JP)
MAKI YOSHIFUMI (JP)
MAKI YOSHIFUMI (JP)
Application Number:
PCT/JP2023/000464
Publication Date:
October 05, 2023
Filing Date:
January 11, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F27/29; H01F17/00; H01F41/04
Foreign References:
| JP2010226017A | 2010-10-07 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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