Title:
ELECTRONIC COMPONENT PRODUCTION METHOD AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/230716
Kind Code:
A1
Abstract:
Provided is a method for producing, via a simple technique, an electronic component wherein the tight adhesion between a fluorine resin and an electronic element is excellent. Also provided is an electronic component. The electronic component production method comprises a step of disposing a resin composition on an electronic element mounted on a wiring base material and a step of heating the resin composition at the melting point thereof or higher, thereby covering the electronic element with the resin composition, the electronic component production method being characterized in that the resin composition contains a crystalline fluorine resin, and contains substantially no volatile components.
Inventors:
YOSHIKAWA GAKU (JP)
NAKATA KUNIHIKO (JP)
IWAWAKI HIROSHI (JP)
NAKATA KUNIHIKO (JP)
IWAWAKI HIROSHI (JP)
Application Number:
PCT/JP2020/018655
Publication Date:
November 19, 2020
Filing Date:
May 08, 2020
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
B29C39/10; C08L27/12; H01L21/56; H01L23/02; H01L23/29; H01L23/31; H01L33/48; H01L33/54; H01L33/56; H01L33/62
Foreign References:
| JP2001102639A | 2001-04-13 | |||
| JPH0845972A | 1996-02-16 | |||
| JP2000228411A | 2000-08-15 | |||
| JPH11106589A | 1999-04-20 | |||
| JP2011530834A | 2011-12-22 |
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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