Title:
ELECTRONIC COMPONENT SAMPLE LABELING METHOD AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/107533
Kind Code:
A1
Abstract:
Disclosed in the present invention is an electronic component sample labeling method, comprising: acquiring images of N electronic component samples to be labeled, where N≥1; matching the image of each electronic component sample with a template image to obtain a matching degree value of said each electronic component sample; sorting, according to the matching degree values, the N electronic component samples, and labeling, from the sorted N electronic component samples, a needed electronic component sample. Correspondingly, an electronic component sample labeling device is further disclosed in the present invention. According to the embodiments of the present invention, the efficiency of labeling the electronic component samples can be improved.
Inventors:
LIN JIANMIN (CN)
Application Number:
PCT/CN2016/096888
Publication Date:
June 29, 2017
Filing Date:
August 26, 2016
Export Citation:
Assignee:
GUANGZHOU SHIYUAN ELECTRONICS CO LTD (CN)
International Classes:
G06K9/46
Foreign References:
| CN104463178A | 2015-03-25 | |||
| EP0611160A2 | 1994-08-17 | |||
| CN105631458A | 2016-06-01 | |||
| CN102938077A | 2013-02-20 | |||
| US20110110597A1 | 2011-05-12 |
Attorney, Agent or Firm:
SCIHEAD PATENT AGENT CO., LTD. (CN)
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