Title:
ELECTRONIC COMPONENT STORAGE PACKAGE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/282317
Kind Code:
A1
Abstract:
An electronic component storage package (100) comprises: a base (10) having a mounting section (11) for an electronic component (80); and a lid (20) covering the mounting section (11). The base (10) is formed from a ceramic. The lid (20) is formed from a resin and has a locking piece (22a) capable of locking to the base (10). An electronic device (200) comprises the electronic component storage package (100) and the electronic component (80) stored in the electronic component storage package (100).
Inventors:
KITAMURA TOSHIHIKO (JP)
NAKAMOTO SHINJI (JP)
TANAKA TSUYOSHI (JP)
NAKAMOTO SHINJI (JP)
TANAKA TSUYOSHI (JP)
Application Number:
PCT/JP2022/026926
Publication Date:
January 12, 2023
Filing Date:
July 07, 2022
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
G02B6/42; H01L21/48; H01L23/02; H01S5/02251; H01S5/02253
Domestic Patent References:
| WO2013047354A1 | 2013-04-04 |
Foreign References:
| JP2006030813A | 2006-02-02 | |||
| JP2000121885A | 2000-04-28 | |||
| JP2015162473A | 2015-09-07 | |||
| JP2005005614A | 2005-01-06 | |||
| JP2009229613A | 2009-10-08 | |||
| JP2001296451A | 2001-10-26 | |||
| US20130313415A1 | 2013-11-28 |
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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