Title:
ELECTRONIC COMPONENT SUPPORT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/047751
Kind Code:
A1
Abstract:
This electronic component support structure is a support structure for supporting an electronic component provided on a substrate, and is provided with a cover member that covers the electronic component. The cover member is an integral structure with a cover component that covers an interface portion for external connection to the substrate.
Inventors:
YAMAGUCHI KENICHI (JP)
KANEKO KOUJI (JP)
KANEKO KOUJI (JP)
Application Number:
PCT/JP2022/032593
Publication Date:
March 07, 2024
Filing Date:
August 30, 2022
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H05K5/03; H05K1/18; H05K5/00; H05K5/02
Foreign References:
| JP2014165186A | 2014-09-08 | |||
| JP2014075496A | 2014-04-24 | |||
| JPH11261254A | 1999-09-24 | |||
| JP2003229683A | 2003-08-15 | |||
| JP2003037913A | 2003-02-07 | |||
| JP2012227344A | 2012-11-15 | |||
| JP2006017250A | 2006-01-19 | |||
| JP2004111897A | 2004-04-08 | |||
| JP2017175735A | 2017-09-28 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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