ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY MEANS OF TRANSIENT LIQUID PHASE SINTERING AND POLYMER SOLDER PASTES

Title:

ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY MEANS OF TRANSIENT LIQUID PHASE SINTERING AND POLYMER SOLDER PASTES

Document Type and Number:

WIPO Patent Application WO/2011/150246

Kind Code:

A3

Abstract:

A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.

Inventors:

MCCONNELL JAMES E (US)
BULTITUDE JOHN (US)
PHILLIPS REGGIE (US)
HILL ALLEN (US)
RENNER GARRY L (US)
LESSNER PHILIP M (US)
CHACKO ANTONY P (US)
BELL JEFFREY (US)
BROWN KEITH (US)

Application Number:

PCT/US2011/038197

Publication Date:

February 23, 2012

Filing Date:

May 26, 2011

Export Citation:

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Assignee:

KEMET ELECTRONICS CORP (US)
MCCONNELL JAMES E (US)
BULTITUDE JOHN (US)
PHILLIPS REGGIE (US)
HILL ALLEN (US)
RENNER GARRY L (US)
LESSNER PHILIP M (US)
CHACKO ANTONY P (US)
BELL JEFFREY (US)
BROWN KEITH (US)

International Classes:

H01G4/12; B23K31/02; H01G4/30

Foreign References:

US20040240146A1	2004-12-02
US6081416A	2000-06-27
US20050286208A1	2005-12-29

Other References: