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Title:
ELECTRONIC COMPONENT TRANSFER METHOD AND ELECTRONIC COMPONENT HANDLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2008/012889
Kind Code:
A1
Abstract:
A handler (1), equipped with a movable head (304) (suction pad (307)) for simultaneously holding and transferring a plurality of IC devices (2) to be tested, performs a first step for leaving an IC device (2) to be tested mounted on a customer tray (KST) at a position corresponding to a socket (40) at socket OFF in the customer tray (KST), holding only an IC device (2) to be tested mounted on a customer tray (KST) at a position corresponding to a socket (40) other than at socket OFF by means of the suction pad (307), and transferring the IC device (2) to be tested from the customer tray (KST) to a test tray (TST) without changing the arrangement when the plurality of IC devices (2) to be tested are transferred from a feeding customer tray (KST) to the test tray (TST), and a second step for transferring the IC device (2) to be tested left in the customer tray (KST) because it is located at a position corresponding to the socket (40) at socket OFF from the customer tray (KST) to the test tray (TST) at a position corresponding to the socket (40) other than at socket OFF.

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Inventors:
KARINO, Koya (32-1 Asahicho 1-chome, Nerima-k, Tokyo 71, 1790071, JP)
狩野 孝也 (〒71 東京都練馬区旭町１丁目３２番１号 株式会社アドバンテスト内 Tokyo, 1790071, JP)
Application Number:
JP2006/314850
Publication Date:
January 31, 2008
Filing Date:
July 27, 2006
Export Citation:
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Assignee:
ADVANTEST CORPORATION (32-1, Asahicho 1-chome Nerima-k, Tokyo 71, 1790071, JP)
株式会社アドバンテスト (〒71 東京都練馬区旭町１丁目３２番１号 Tokyo, 1790071, JP)
KARINO, Koya (32-1 Asahicho 1-chome, Nerima-k, Tokyo 71, 1790071, JP)
International Classes:
G01R31/26; G01R31/26
Attorney, Agent or Firm:
HAYAKAWA, Yuzi et al. (Arcadia Patent Firm, Suite 501 Hikawa-Annex No.2, 9-5, Akasaka 6-chome, Minato-k, Tokyo 52, 1070052, JP)
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