ELECTRONIC COMPONENT FOR WELDING, MOUNTED BOARD AND TEMPERATURE SENSOR

WIPO Patent Application WO/2018/066473

A1

The present invention efficiently enables the achievement of: high density mounting by means of an electronic component for welding, which has a function of a resistor, a capacitor, an inductor or the like; and improvement of thermal responsivity and improvement of tensile strength at high temperatures by means of reduction in size and thickness of a temperature sensor. An electronic component (10) for welding, which has a function of a resistor, a capacitor, an inductor or the like, comprises: an insulating substrate (12); a function part (14) and a bonding electrode part (16), which are provided on the insulating substrate (12); and a lead (18) which is electrically connected to the bonding electrode part (16). The bonding electrode part (16) is configured of: an adhesive active metal layer (20) which is formed from a high-melting-point metal on the insulating substrate (12); a barrier layer (22) which is formed from a high-melting-point metal on the active metal layer (20); and a bonding metal layer (24) which is mainly composed of a low-melting-point metal and is formed on the barrier layer (22).

HIRABAYASHI TAKAAKI (JP)
CHENG DEZHI (JP)

PCT/JP2017/035493

April 12, 2018

September 29, 2017

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SEMITEC CORP (JP)

H01G4/228; G01K7/18; G01K7/22; H01C7/00; H01C7/02; H01C7/04; H01G4/33

JP2013008918A	2013-01-10
JP2013197367A	2013-09-30
JP2014116456A	2014-06-26
JP2013187322A	2013-09-19
JP2014092428A	2014-05-19
JP2006049620A	2006-02-16
JPH02269924A	1990-11-05
JPS5029253U	1975-04-03

IZUMI Junichi (JP)

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