ELECTRONIC COMPONENT

WIPO Patent Application WO2005056734

A3

A low profile surface mountable inductive component (10) having an elongated core (12) having first and second ends (12a, 12b) and first and second supports (20, 22) for supporting the core. Metalized pads (28, 30) are provided on the supports for electrically connecting and mounting the supports to a printed circuit board, and a wire (32) is wound about at least a portion of the core with the wire ends being electrically connected to the metalized pads (28, 30) of the supports (20, 22). In one form, the core and supports define a chip form having a length ranging from 02.mm to 0.8mm, a width ranging from 0.1mm to 0.6mm, and a height ranging from 0.2mm to 0.6mm. In another form, the component has a cover (38) covering at least a portion of the wire winding and the component has a length ranging from 0.2mm to 1.0mm, a width ranging from 0.2mm to 0.7mm, and a height ranging from 0.2mm to 0.7mm.

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WO/2014/018082	METHODS FOR UPGRADING OF CONTAMINATED HYDROCARBON STREAMS

HESS SCOTT (US)

PCT/US2004/040494

October 27, 2005

December 03, 2004

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COILCRAFT INC (US)
HESS SCOTT (US)

C10G17/06; C10G21/08; C10G45/02; C10G67/08; H01F5/00; H01F27/29; H02G3/08; H05K3/34; H01F3/12; H01F17/04; H01F27/02; H01F41/10; (IPC1-7): H01F5/00

US6242996B1	2001-06-05
US4704592A	1987-11-03

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