Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2010/092861
Kind Code:
A1
Abstract:
An electronic component wherein stray capacitance between a coil and external electrodes can be reduced and occurrences of delamination can be suppressed. The coil (L) is housed inside a multilayer structure (12) and comprises via hole conductors and coil conductors (18). The coil conductors (18) are a plurality of coil conductors which overlap each other when seen from a planar view from the z-axis direction and thereby form a ring-shaped path (R) comprising two straight line parts (P1,P2) extending in the same direction and two arc-shaped parts (P3,P4) joining the ends of the two straight line parts (P1,P2). The coil conductors (18) have land parts (22,24) to which the via hole conductors are connected to. The land parts (22, 24) are arranged at equal distances on the path (R) when seen from a planar view from the z-axis direction.
Inventors:
KUROBE JUNJI (JP)
Application Number:
PCT/JP2010/050684
Publication Date:
August 19, 2010
Filing Date:
January 21, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
KUROBE JUNJI (JP)
KUROBE JUNJI (JP)
International Classes:
H01F17/00
Domestic Patent References:
| WO2008018203A1 | 2008-02-14 |
Foreign References:
| JP2000082615A | 2000-03-21 | |||
| JP2005191191A | 2005-07-14 | |||
| JP2005167130A | 2005-06-23 |
Attorney, Agent or Firm:
MORISHITA Takekazu et al. (JP)
Takeichi Morishita (JP)
Takeichi Morishita (JP)
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