ELECTRONIC COMPONENT

WIPO Patent Application WO/2011/155241

A1

Provided is an electronic component capable of being produced inexpensively, wherein it is possible to prevent the electronic component from misaligning relative to a normal mounting position. A laminate is formed by laminating a plurality of insulating layers (16). Connection conductors (20), which are internal conductors disposed on the insulating layers (16), have exposed portions (P1) exposed between the insulating layers (16) on the bottom side (S10) of the laminate. An external electrode (14a) is formed by means of a plating process on the bottom side (S10) so as to cover the exposed portions (P1). The exposed portions (P1) are not arranged to have an equal spacing therebetween in the x axis direction. As a consequence, the surface of the external electrode (14a) is uneven.

ONO Akihiro (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
大野　晃弘 (〒55 京都府長岡京市東神足１丁目１０番１号　株式会社村田製作所内 Kyoto, 〒6178555, JP)
ODAHARA Mitsuru (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)

JP2011/056195

December 15, 2011

March 16, 2011

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MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足１丁目１０番１号 Kyoto, 〒6178555, JP)
ONO Akihiro (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
大野　晃弘 (〒55 京都府長岡京市東神足１丁目１０番１号　株式会社村田製作所内 Kyoto, 〒6178555, JP)

H01F27/29; H01F17/00; H01F41/10; H01G4/12; H01G4/30

MORISHITA Takekazu et al. (Hommachi Eiwa Building, 2-10 Minamihommachi 4-chome, Chuo-ku, Osaka-sh, Osaka 54, 〒5410054, JP)

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