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Patent Searching and Data


Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2012/020590
Kind Code:
A1
Abstract:
Provided is a high-impedance electronic component wherein the occurrence of a short circuit fault is suppressed. An electronic component (10) is provided with a laminate in which a plurality of first insulator layers (13) and a plurality of second insulator layers (14) are alternately laminated, and a coil which has a plurality of first conductor patterns (16) respectively provided on the first insulator layers (13) and a plurality of second conductor patterns (17) respectively provided on the second insulator layers (14) and is embedded in the laminate. The first conductor patterns (16) and the second conductor patterns (17) compose a plurality of double conductor patterns (20) in each of which at least one end of the first conductor pattern (16) and at least one end of the second conductor pattern (17) are connected to each other by a second via hole conductor (19) penetrating the second insulator layer (14), the plurality of double conductor patterns (20) are helically connected by first via hole conductors (18) each penetrating the first insulator layer (13), and the thickness of the second insulator layers (14) is smaller than the thickness of the first insulator layers (13).

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Inventors:
OISHI MASAYUKI (JP)
TANIKI NOBUYUKI (JP)
Application Number:
JP2011/061806
Publication Date:
February 16, 2012
Filing Date:
May 24, 2011
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (?6178555, JP)
OISHI MASAYUKI (JP)
TANIKI NOBUYUKI (JP)
International Classes:
H01F17/00
Domestic Patent References:
WO2009016937A12009-02-05
Foreign References:
JPH0536533A1993-02-12
JPH1197244A1999-04-09
JP2009044030A2009-02-26
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Claims: