Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2014/136843
Kind Code:
A1
Abstract:
Provided is an electronic component in which the occurrence of chipping in a laminate can be suppressed. A laminate (12) is constituted by laminating a plurality of rectangular insulator layers, and comprises: a bottom surface (S2) that is constituted by contiguously arranging the outer edges of the plurality of insulators; an end surface (S3) that is adjacent to said bottom surface (S2), and that is constituted by contiguously arranging the outer edges of the plurality of insulators; and a side surface (S6) located on the negative-direction side in the y-axis direction. An external electrode (14a) is embedded in the laminate (12) in a state where the external electrode lies across the bottom surface (S2) and the end surface (S3) and is exposed from the laminate (12). A coil (L) is provided to the laminate (12), and is connected to the external electrode (14a). The distance between the external electrode (14a) and the side surface (S6) at the corner between the bottom surface (S2) and the end surface (S3) is greater than the distance between the external electrode (14a) and the side surface (S6) in a section where the external electrode (14a) and the coil (L) are connected.
Inventors:
TAKEZAWA KAORI (JP)
Application Number:
PCT/JP2014/055645
Publication Date:
September 12, 2014
Filing Date:
March 05, 2014
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F17/00; H01F27/29
Foreign References:
| JP2013038392A | 2013-02-21 | |||
| JP2008060214A | 2008-03-13 |
Attorney, Agent or Firm:
PROFIC PC (JP)
Patent business corporation pro フィック patent firm (JP)
Patent business corporation pro フィック patent firm (JP)
Download PDF: