Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2014/181755
Kind Code:
A1
Abstract:
Provided is an electronic component that can have a decreased height in the lamination direction while effecting a decrease in current resistance. The electronic component (10) is characterized by being provided with: a laminate body (12) resulting from laminating insulating body layers (16); a helical coil (L) that results from a coil conductor (18) provided to the insulating body layers (16) being connected by means of via hole conductors (v1-v3) that penetrate the insulating body layers (16) in the direction of lamination; and a parallel conductor (20) that is provided to the insulating body layer to which the coil conductor (18) is provided and that is connected in parallel to the coil conductor (18) with the via hole conductors (v1-v3, v11-v13) penetrating in the direction of lamination of the insulating body layers (16) therebetween. The electric component (10) is further characterized in that the conductor width of at least a portion of the coil conductor (18) that is not connected in parallel to the parallel conductor (20) is thicker than the conductor width of the portion of the coil conductor (18) that is connected in parallel to the parallel conductor (20) and excluding the portions to which the via hole conductors (v1-v3, v11-v13) are connected.
Inventors:
TACHIBANA KAORU (JP)
HASHIMOTO HIROKI (JP)
HASHIMOTO HIROKI (JP)
Application Number:
PCT/JP2014/062097
Publication Date:
November 13, 2014
Filing Date:
May 01, 2014
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F17/00
Domestic Patent References:
| WO2006073092A1 | 2006-07-13 |
Foreign References:
| JP2010245134A | 2010-10-28 | |||
| JP2013162101A | 2013-08-19 |
Attorney, Agent or Firm:
PROFIC PC (JP)
Patent business corporation pro フィック patent firm (JP)
Patent business corporation pro フィック patent firm (JP)
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