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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2016/157595
Kind Code:
Provided is an electronic component which does not require a joining material such as solder to be separately prepared when being mounted, and with which mounting can be performed efficiently. A configuration is employed in which a joining material including solder and resin is provided to the mounting surface. A substance which includes a crosslinked resin which is liquid between 15˚C and 25˚C inclusive, and a crosslinked resin which is solid between 15˚C and 25˚C inclusive is used as the resin forming the joining material. Thermosetting resins are used as the crosslinked resins. Epoxy resins are used as the thermosetting resins. The content ratio of the liquid crosslinked resin to the solid crosslinked resin, expressed as a weight ratio, is in the range of 5:95 to 95:5. The solder content is in the range of 2.5 vol% to 50 vol% inclusive. An Sn-based solder having Sn as one main component is used as the solder. An SnAgCu-based solder or an SnBi-based solder is used as the Sn-based solder.

NOMURA, Akihiro (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
Publication Date:
October 06, 2016
Filing Date:
November 06, 2015
Export Citation:
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MURATA MANUFACTURING CO.,LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
H01G4/232; H01G4/30; H05K3/34
Foreign References:
Attorney, Agent or Firm:
NISHIZAWA, Hitoshi (5th Floor, Daido Seimei Minami-kan 1-2-11, Edobori, Nishi-ku, Osaka-sh, Osaka 02, 〒5500002, JP)
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