Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/180178
Kind Code:
A1
Abstract:
An electronic component (1) is provided with: a substrate (10) having mounting components (22, 24) that are mounted on a first main surface; a recessed section (12) that is provided in a recessed shape in a second main surface of the substrate (10), said second main surface being on the reverse side of the first main surface; an inner electrode (14) that is disposed at least on a part of the bottom surface of the recessed section (12); a plurality of outer electrodes (16) that are disposed on a part of a peripheral section (13) of the second main surface, said peripheral section excluding the recessed section (12); and a first separation section (30), i.e., an exposed peripheral section (13), between the outer electrodes (16) and the recessed section (12).
Inventors:
MATSUMOTO SHO (JP)
Application Number:
PCT/JP2018/007820
Publication Date:
October 04, 2018
Filing Date:
March 01, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/12; H01F27/06; H01F27/29; H01G2/06; H01L25/00
Domestic Patent References:
| WO2011021364A1 | 2011-02-24 |
Foreign References:
| JP2007305740A | 2007-11-22 | |||
| JPH1065338A | 1998-03-06 | |||
| JPH08241827A | 1996-09-17 | |||
| JP2007048844A | 2007-02-22 | |||
| JP2005276950A | 2005-10-06 | |||
| JP2015146404A | 2015-08-13 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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